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FDW2508P Download

partno	mfr	description	Magnitude	download
FDW2508P	FAIRCHILD	Fairchild Semiconductor [Dual P-Channel 1.8 V Specified PowerTrench MOSFET]	136k

FDW2508P December 2001 FDW2508P Dual P-Channel 1.8 V Specified PowerTrench MOSFET General Description This P-Channel ?1.8V specified MOSFET uses Fairchild's advanced low voltage PowerTrench process. It has been optimized for battery power management applications. Features ? ?6 A, ?12 V. RDS(ON) = 18 m @ VGS = ?4.5 V RDS(ON) = 22 m @ VGS = ?2.5 V RDS(ON) = 30 m @ VGS = ?1.8 V Low gate charge(26nC typical) High performance trench technology for extremely low RDS(ON) Low profile TSSOP-8 package Applications ? ? ? Power management Load switch Battery protection ? ? ? G2 S2 S2 D2 G1 S1 S1 D1 Pin 1 1 2 3 4 8 7 6 5 TSSOP-8 Absolute Maximum Ratings Symbol VDSS VGSS ID PD TJ, TSTG Drain-Source Voltage Gate-Source Voltage Drain Current ? Continuous ? Pulsed TA=25oC unless otherwise noted Parameter Ratings ?12 ?8 (Note 1) Units V V A W ?C ?6 ?30 1.3 1 ?55 to +150 Power Dissipation for Single Operation (Note 1a) (Note 1b) Operating and Storage Junction Temperature Range Thermal Characteristics RJA Thermal Resistance, Junction-to-Ambient (Note 1a) (Note 1b) 100 125 ?C/W Package Marking and Ordering Information Device Marking 2508P Device FDW2508P Reel Size 13'' Tape width 12mm Quantity 2500 units 2001 Fairchild Semiconductor Corporation FDW2508P Rev. E (W) FDW2508P Electrical Characteristics Symbol BVDSS BVDSS TJ IDSS IGSSF IGSSR VGS(th) VGS(th) TJ RDS(on) TA = 25?C unless otherwise noted Parameter Drain?Source Breakdown Voltage Breakdown Voltage Temperature Coefficient Zero Gate Voltage Drain Current Gate?Body Leakage, Forward Gate?Body Leakage, Reverse (Note 2) Test Conditions VGS = 0 V, ID = ?250 ?A Min ?12 Typ Max Units V Off Characteristics ID = ?250 ?A, Referenced to 25?C VDS = ?10 V, VGS = 8 V, VGS = ?8 V, VGS = 0 V VDS = 0 V VDS = 0 V ID = ?250 ?A ?0.4 ?0.5 2.7 14 17 22 18 ?30 32 2644 987 602 VDD = ?6 V, VGS = ?4.5 V, ID = ?1 A, RGEN = 6 18 22 30 25 ?2 ?1 100 ?100 ?1.5 mV/?C ?A nA nA V mV/?C m On Characteristics Gate Threshold Voltage Gate Threshold Voltage Temperature Coefficient Static Drain?Source On?Resistance On?State Drain Current Forward Transconductance Input Capacitance Output Capacitance Reverse Transfer Capacitance (Note 2) VDS = VGS, ID = ?250 ?A, Referenced to 25?C VGS = ?4.5 V, ID = ?6 A VGS = ?2.5 V, ID = ?5 A VGS = ?1.8 V, ID = ?4 A VGS = ?4.5 V, ID = ?6A, TJ=125?C VGS = ?4.5 V, VDS = ?5 V VDS = ?5 V, VDS = ?6 V, f = 1.0 MHz ID = ?6 A V GS = 0 V, ID(on) gFS Ciss Coss Crss A S pF pF pF Dynamic Characteristics Switching Characteristics td(on) tr td(off) tf Qg Qgs Qgd IS VSD Turn?On Delay Time Turn?On Rise Time Turn?Off Delay Time Turn?Off Fall Time Total Gate Charge Gate?Source Charge Gate?Drain Charge 14 9.1 122 89 25 18 195 142 36 ns ns ns ns nC nC nC VDS = ?6 V, VGS = ?4.5 V ID = ?6 A, 26 4 7 Drain?Source Diode Characteristics and Maximum Ratings Maximum Continuous Drain?Source Diode Forward Current Drain?Source Diode Forward Voltage VGS = 0 V, IS = ?1.1 A (Note 2) ?1.1 ?0.59 ?1.2 A V Notes: 1. RJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RJC is guaranteed by design while RCA is determined by the user's board design. a) b) RJA is 100?C/W (steady state) when mounted on a 1 inch? copper pad on FR-4. RJA is 125?C/W (steady state) when mounted on a minimum copper pad on FR-4. 2. Pulse Test: Pulse Width < 300?s, Duty Cycle < 2.0% FDW2508P Rev. E (W) FDW2508P Typical Characteristics 60 VGS = -4.5V -3.0V 2 RDS(ON), NORMALIZED DRAIN-SOURCE ON-RESISTANCE -2.5V -2.0V -1.8V -ID, DRAIN CURRENT (A) 1.8 1.6 45 VGS = -1.8V -2.0V 30 1.4 -2.5V 1.2 1 0.8 15 -1.5V -3.0V -3.5V -4.5V 0 0 1 2 3 4 -VDS, DRAIN TO SOURCE VOLTAGE (V) 0 15 30 -ID, DIRAIN CURRENT (A) 45 60 Figure 1. On-Region Characteristics. Figure 2. On-Resistance Variation with Drain Current and Gate Voltage. 0.045 RDS(ON), ON-RESISTANCE (OHM) 1.4 RDS(ON), NORMALIZED DRAIN-SOURCE ON-RESISTANCE ID = -6A VGS = -4.5V 1.2 ID = -3A 0.035 TA = 125oC 0.025 TA = 25oC 0.015 1 0.8 0.6 -50 -25 0 25 50 75 100 125 150 TJ, JUNCTION TEMPERATURE (oC) 0.005 1 2 3 4 5 -VGS, GATE TO SOURCE VOLTAGE (V) Figure 3. On-Resistance Variation with Temperature. 40 VDS = -5V -ID, DRAIN CURRENT (A) 30 -IS, REVERSE DRAIN CURRENT (A) TA = -55oC 25oC 125 C o Figure 4. On-Resistance Variation with Gate-to-Source Voltage. 100 10 1 0.1 0.01 0.001 TA = 125oC 25oC -55oC VGS = 0V 20 10 0 0.6 1 1.4 1.8 2.2 -VGS, GATE TO SOURCE VOLTAGE (V) 0.0001 0 0.2 0.4 0.6 0.8 1 1.2 -VSD, BODY DIODE FORWARD VOLTAGE (V) Figure 5. Transfer Characteristics. Figure 6. Body Diode Forward Voltage Variation with Source Current and Temperature. FDW2508P Rev. E (W) FDW2508P Typical Characteristics 5 -VGS, GATE-SOURCE VOLTAGE (V) ID = -6A 4 VDS = -4V -6V CAPACITANCE (pF) 4000 f = 1 MHz VGS = 0 V 3000 -8V CISS 3 2000 2 COSS 1000 1 CRSS 0 0 5 10 15 20 25 30 0 3 6 9 12 Qg, GATE CHARGE (nC) -VDS, DRAIN TO SOURCE VOLTAGE (V) 0 Figure 7. Gate Charge Characteristics. 100 100? 1ms 10ms 100m 1 VGS = -4.5V SINGLE PULSE RJA = 125oC/W TA = 25oC 0.01 0.01 1s DC P(pk), PEAK TRANSIENT POWER (W) 30 25 20 15 10 5 Figure 8. Capacitance Characteristics. -ID, DRAIN CURRENT (A) RDS(ON) LIMIT 10 SINGLE PULSE RJA = 125?C/W TA = 25?C 0.1 0.1 1 10 100 0 0.001 0.01 0.1 1 t1, TIME (sec) 10 100 1000 -VDS, DRAIN-SOURCE VOLTAGE (V) Figure 9. Maximum Safe Operating Area. Figure 10. Single Pulse Maximum Power Dissipation. 1 r(t), NORMALIZED EFFECTIVE TRANSIENT THERMAL RESISTANCE D = 0.5 0.2 RJA(t) = r(t) * RJA RJA = 125 C/W P(pk) t1 t2 SINGLE PULSE o 0.1 0.1 0.05 0.02 0.01 0.01 TJ - TA = P * RJA(t) Duty Cycle, D = t1 / t2 0.001 0.0001 0.001 0.01 0.1 t1, TIME (sec) 1 10 100 1000 Figure 11. Transient Thermal Response Curve. Thermal characterization performed using the conditions described in Note 1b. Transient thermal response will change depending on the circuit board design. FDW2508P Rev. E (W) TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACExTM BottomlessTM CoolFETTM CROSSVOLTTM DenseTrenchTM DOMETM EcoSPARKTM E2CMOSTM EnSignaTM FACTTM FACT Quiet SeriesTM DISCLAIMER FAST ? FASTrTM FRFETTM GlobalOptoisolatorTM GTOTM HiSeCTM ISOPLANARTM LittleFETTM MicroFETTM MicroPakTM MICROWIRETM OPTOLOGICTM OPTOPLANARTM PACMANTM POPTM Power247TM PowerTrench ? QFETTM QSTM QT OptoelectronicsTM Quiet SeriesTM SILENT SWITCHER ? SMART STARTTM STAR*POWERTM StealthTM SuperSOTTM-3 SuperSOTTM-6 SuperSOTTM-8 SyncFETTM TinyLogicTM TruTranslationTM UHCTM UltraFET ? VCXTM STAR*POWER is used under license FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or 2. A critical component is any component of a life systems which, (a) are intended for surgical implant into support device or system whose failure to perform can the body, or (b) support or sustain life, or (c) whose be reasonably expected to cause the failure of the life failure to perform when properly used in accordance support device or system, or to affect its safety or with instructions for use provided in the labeling, can be effectiveness. reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative or In Design Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. Preliminary First Production No Identification Needed Full Production Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Rev. H4 http://www.icinfo.net http://pdf.ecgoo.net

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